HexBond® Foaming Adhesive Films for Lightweight Structural Bonding

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Engineered for precision and performance delivering a unique combination of expansion capability, thermal stability, and structural integrity

HexBond® foaming adhesive films are advanced, expandable adhesives designed for demanding aerospace and industrial bonding applications.

adhesive foaming

Why Engineers Choose Our HexBond® Foaming Adhesive Films

Our adhesives combine lightweight design with exceptional strength, ensuring reliable structural integrity even in complex assemblies.
  • Expandable Formulation: Expands during cure to fill gaps and bond irregular surfaces.  
  • Lightweight: Ideal for honeycomb and sandwich structures where weight savings are critical.  
  • Versatile Cure Cycles: Compatible with standard aerospace cure temperatures (typically 120°C or 180°C).  
  • Thermal Stability: Service temperatures suitable for aerospace and industrial environments.  
  • Strong Adhesion: Provides robust mechanical strength for primary and secondary structures.
Feature/ProductHexBond® 200 SeriesHexBond® ST1150
ChemistryEpoxy-basedEpoxy-based
Expansion Ratio120-220%120% @120°C & 170% @180°C
Service Temperature−55°C to 100-150°C−55°C to 150°C
Key ApplicationsHoneycomb splicing, gap filling, densificationHoneycomb splicing, gap filling, densification
Cure Temperature120°C or 180°CDual: 120°C or 180°C
Special FeaturesHigh expansion ratio to fill large gapsProcess flexibility – Dual cure option
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Technical Resources

Find all the documentation you need for adhesives.
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Primers

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HexBond® 100 Series EU Version
US version
HexBond® HP655P EU Version

Foaming Adhesive Films

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HexBond® 200 Series EU Version
HexBond® ST1150 Global Version

Epoxy Paste Adhesive

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HexBond™ EA9309.3NA STRUCTIL Global Version
HexBond® EA9321 STRUCTIL Global Version
HexBond® EA9390 STRUCTIL Global Version
HexBond® EA9394 STRUCTIL Global Version
HexBond® EA9395 STRUCTIL Global Version
HexBond® EA9396 STRUCTIL Global Version
HexBond® ST1007 Global Version
HexBond® ST1020 Global Version
HexBond™ EA934NA STRUCTIL Global Version
HexBond™ EA9346.5 STRUCTIL Global Version
HexBond® EA9392 STRUCTIL Global Version
HexBond® ST1060 Global Version

Epoxy Liquid Adhesives

Products Downloads
HexBond™ EA956 STRUCTIL Global Version

Epoxy Film Adhesives

Products Downloads
HexBond® 312 EU Version
HexBond® 319 EU Version
US version
HexBond® 322 EU Version
US version
HexBond® 340U(SP) EU Version
HexBond® 641 EU Version
HexBond® EA9686 STRUCTIL Global Version
HexBond® ST1035 Global Version
HexBond® ST1480 Global Version
HexBond® 679 EU Version

Epoxy Fillet

Products Downloads
HexBond® EA9685-1 STRUCTIL Global Version

Core Splice Adhesive

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HexBond® EA9833.1 STRUCTIL Global Version

BMI Paste Adhesives

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HexBond® EA9351MB STRUCTIL Global Version

BMI Film Adhesives

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HexBond® HP655 EU Version
HexBond® EA9674 STRUCTIL Global Version

Additional Resources

GUIDE

HexBond® Adhesives Selector Guide

BROCHURE

Adhesive Bonding Technology

FAQs

Answers That Power Precision

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HexBond® Foaming Adhesive Films are expandable adhesives designed to fill gaps and bond irregular surfaces during the curing process. They are widely used in aerospace and industrial applications for honeycomb splicing and sandwich structures, offering lightweight construction, strong adhesion, and thermal stability.

Their expandable formulation reduces the need for additional fillers and simplifies assembly, saving time and minimizing material waste.

These adhesives bond effectively to metals, composites, and honeycomb cores, making them versatile for aerospace and industrial structures.

Yes, both the 200 Series and ST1150 should be stored at or below −18°C to maintain shelf life and performance.

Yes, their gap-filling capability and strong adhesion make them suitable for structural repairs and core splicing in service environments.

The 200 Series offers a range of expansion ratios for honeycomb splicing and gap filling, while ST1150 is a dual-cure core splice adhesive qualified, with specific expansion performance at different cure temperatures.

Yes, both products are widely used in aerospace for lightweight structural bonding, especially in sandwich and honeycomb assemblies.

Both products cure at standard aerospace temperatures (120°C or 180°C),but always refer to the technical data sheet for specific recommendations.

Always follow Hexcel’s recommended handling procedures, including proper PPE and curing protocols, as outlined in the technical data sheets.