HexBond^® Film Adhesives for Aerospace and Industrial Bonding

HexBond^® Film Adhesives designed for demanding aerospace and industrial bonding applications. These adhesives are supplied in film form and rely on elevated temperature curing, typically at 120°C or 180°C under pressure, to achieve their full mechanical properties. This curing process ensures strong, durable bonds that meet stringent structural requirements.

One of the defining characteristics of HexBond^® film adhesives is their flexibility in cure cycles. Certain grades, such as HexBond^® ST1035, offer broad cure window, e.g. from 10 hours at 90°C up to 45 minutes at 135°C, providing manufacturers with processing versatility. Service temperatures for these adhesives range from −55°C up to 240°C for continuous use, making them suitable for environments where thermal stability is critical.